Steed ST

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Steed ST Series

Predefined for Production Throughput and Yield

Description:

The ST Series Furnace Systems line features horizontal furnace systems configured for diffusion, oxidation and LPCVD processing.

Standardized 4-stack models are offered to accommodate 75, 100, 125, 150 or 300mm wafers. Each cost-effective model is engineered to handle the rigors of high production environments with rugged designs that sustain high uptime, easy maintenance and optimum process control.

Complete systems include the appropriately sized furnace with load station, automatic loaders, a fully facilitated source or pump cabinet and computerized process control. Complete process chamber assemblies for most all diffusion, oxidation and LPCVD processes with guaranteed process performance specification are available with each model.

Computer designed and fabricated using the highest quality components and manufacturing techniques, the ST Series systems provide a complete processing system with the optimum performance and maintainability you would expect from such a system — and with low COO.

Available Models

Model ST-812-10

2-stack diffusion furnace

200 or 300mm wafer processing

10″ thermal flatzone

Max. process tube OD of 420mm

Model ST-812-16

2-stack diffusion furnace

200 or 300mm wafer processing

16″ thermal flatzone

Max. process tube OD of 420mm

Model ST-812-30

2-stack diffusion furnace

200 or 300mm wafer processing

30″ thermal flatzone

Max. process tube OD of 420mm

Model ST-812-40

2-stack diffusion furnace

200 or 300mm wafer processing

40″ thermal flatzone

Max. process tube OD of 420mm

Model ST-3530

4-stack diffusion furnace

75 or 100mm wafer processing

30″ thermal flatzone

Max. process tube OD of 190mm

Model ST-3540

4-stack diffusion furnace

75 or 100mm wafer processing

40″ thermal flatzone

Max. process tube OD of 190mm

Model ST-5630

4-stack diffusion furnace

125 or 150mm wafer processing

30″ thermal flatzone

Max. process tube OD of 250mm

Model ST-5640

4-stack diffusion furnace

125 or 150mm wafer processing

40″ thermal flatzone

Max. process tube OD of 250mm

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